Researchers sought to develop photonic devices (modulators, detectors, packaging) for high-performance computing interconnects, using advanced design, fabrication, and characterization tools.
NRC Research Associateship Programs has archived this opportunity.
Funder: NRC Research Associateship Programs
Due Dates: May 1, 2025 (Next deadline)
Funding Amounts: Stipend approximately $86,335 per year plus $3,000 travel allowance; relocation assistance available. Typical tenure 2-3 years.
Summary: Fellowship opportunity to develop integrated photonic devices for high-performance computing interconnects, combining advanced design, nanofabrication, and characterization techniques.
Key Information: Open to U.S. citizens, permanent residents, and non-U.S. citizens; postdoctoral and senior researchers eligible; research conducted at NSA Laboratory for Physical Sciences in College Park, MD.
This fellowship opportunity at the National Security Agency (NSA) Laboratory for Physical Sciences focuses on advancing integrated photonic devices to improve high-performance computing interconnects. Current electronic interconnects for short links (<3 m) face increasing inefficiency and latency as bandwidth demands grow. Integrated photonic interconnects offer a promising energy-efficient alternative but require further device research to compete with existing electronic technologies.
The research involves developing photonic devices such as 2D-material-based modulators, low-noise detectors, and precision photonic packaging solutions suitable for both room temperature and cryogenic environments. The group employs advanced simulation tools including finite-difference time-domain (FDTD) and finite element method (FEM) software for photonic integrated circuit design. Fabrication is performed in-house using state-of-the-art nanofabrication equipment like E-beam lithography and 2D film stackers. Several photonic characterization stations are available for both room temperature and cryogenic testing.
Ideal candidates will have skills in photonic device design, nanofabrication, 2D material characterization, and integrated photonic device characterization.