Advanced Packaging of Chiplets and Heterogeneous Integration in Europe
Supports collaborative research and innovation to advance chiplet and heterogeneous integration technologies, standardization, sustainability, and workforce skills in Europe's advanced packaging ecosystem.
This grant is no longer accepting proposals
European Commission has archived this opportunity.
Funder: European Commission
Due Dates: February 24, 2026 | February 25, 2026
Funding Amounts: €2,000,000 total; expected grant size €500,000–€2,000,000; typically 1 grant awarded; project duration and funding rate per call documents.
Summary: Supports collaboration, standardization, sustainability, and workforce development in advanced packaging, chiplet, and heterogeneous integration technologies across Europe.
Key Information: Single-stage submission; highly competitive topic; consortium required.
Description
This grant opportunity aims to strengthen and future-proof the European advanced packaging ecosystem, with a particular focus on chiplets and heterogeneous integration. The initiative targets improved collaboration among research institutions, industry, and networks; accelerated standardization and interoperability; sustainable manufacturing practices; and workforce upskilling. Projects should address supply chain resilience, environmental sustainability, adoption of standards, knowledge sharing, and the development of specialized training programs. The call is part of the Digital Europe Programme and is managed under the Chips Joint Undertaking (Chips JU).
