Funder: NRC Research Associateship Programs
Due Dates: May 1, 2025 (Application Deadline)
Funding Amounts: Base stipend approximately $95,000 plus $5,000 travel allowance; experience-based supplements available; typical fellowship duration 2-3 years.
Summary: Supports postdoctoral and senior researchers to develop advanced 3D heterogeneous integration packaging techniques using traditional and additive manufacturing methods to improve electronic device performance.
Key Information: Open to U.S. citizens; requires contacting a Research Adviser prior to applying; relocation and health insurance benefits included.