Microscopic and Spectroscopic Characterization in Engineered Polymeric Materials
This research develops advanced microscopy and spectroscopy techniques to study how polymeric materials change and degrade over time in various applications.
This grant is no longer accepting proposals
NRC Research Associateship Programs has archived this opportunity.
Funder: NRC Research Associateship Programs
Due Dates: February 1, 2025 | May 1, 2025 | August 1, 2025 | November 1, 2025
Funding Amounts: Stipend approximately $82,764 per year plus $3,000 travel allowance; typical appointment duration 2 years.
Summary: Fellowship supporting postdoctoral research developing advanced microscopic and spectroscopic techniques to characterize physical and chemical properties of engineered polymeric materials during service.
Key Information: Open to U.S. citizens with a doctoral degree; research conducted on-site at NIST in Gaithersburg, MD; applicants must contact research advisers prior to applying.
Description
This fellowship opportunity at the National Institute of Standards and Technology (NIST) supports postdoctoral research focused on developing and applying advanced microscopic and spectroscopic characterization techniques to study engineered polymeric materials. The research aims to understand physical and chemical property changes, microstructural evolution, and chemical degradation in complex multilayer polymer systems during their service lives, particularly in energy, infrastructure, and related applications.
Techniques explored include atomic force microscopy, electric force microscopy, laser scanning confocal microscopy, scanning electron microscopy, infrared microscopy, Raman microscopy, fluorescence microscopy, ultraviolet-visible spectroscopy, and X-ray photoelectron spectroscopy. The research emphasizes studying microstructural changes and degradation at surfaces, individual layers, and interfaces within multilayer polymer systems. Recent projects have included investigating failure modes and degradation mechanisms in polymeric encapsulation materials used in photovoltaic modules and light-emitting diodes.
