Project Call 11.0: Industrialization & Integration
Project Call 11.0: Industrialization & Integration supports industry and research teams advancing hybrid electronics manufacturing and integration to strengthen the U.S. manufacturing industrial base.
Funder: NextFlex
Due Dates: December 2, 2026 (Online cover sheet) | December 9, 2026, 5:00 p.m. Pacific (Full proposal)
Funding Amounts: Up to $500,000–$1,000,000 per project by topic, for up to 18 months; minimum 1:1 cost share
Summary: Supports hybrid electronics manufacturing maturation, process qualification, and structural integration to strengthen the U.S. manufacturing industrial base.
Key Information: All work must occur within U.S. operations; funded performers must join NextFlex before agreements are finalized.
Description
NextFlex’s second installment of Project Call 11.0 supports technically focused development that advances hybrid electronics manufacturing and its transition into commercial and defense applications. It targets shared manufacturing gaps rather than basic research or product development. Hybrid electronics combines additive processing with discrete electronic components and may use rigid, flexible, stretchable, or conformal designs.
The call covers manufacturing maturation and system integration, qualification and certification frameworks, and electronics integrated into structures and platforms. Projects should demonstrate measurable manufacturing improvements, align with NextFlex roadmaps, and explain their value to the U.S. hybrid electronics ecosystem. Industry-driven work, credible commercialization or technology-transition plans, engaged defense stakeholders, and leverage of prior NextFlex investments are encouraged.
