International collaboration EU and Japan on semiconductors
International collaboration EU and Japan on semiconductors supports EU–Japan consortia developing AI chiplets, advanced integration and chiplet interfaces to deliver direct benefits for European industry.
Funder: Chips Joint Undertaking
Due Dates: July 7, 2026 (Opening) | December 8, 2026 (Closing)
Funding Amounts: €5 million total topic budget; expected EU contribution of €3–5 million per project; 2 expected grants
Summary: Supports EU–Japan semiconductor collaboration on advanced heterogeneous integration and standardised chiplet interfaces for AI, with direct impact on European industry.
Key Information: Participation is restricted for European digital infrastructure and supply-chain security, with ownership-control declarations required from participants not validated as public bodies.
Description
Chips Joint Undertaking runs this collaborative call under the Digital Europe Programme’s Chips for Europe area. It supports work with Japanese consortia on a chiplet ecosystem for artificial intelligence and advanced process technologies for nodes beyond 2 nm. Expected outcomes include advanced heterogeneous integration—particularly 2.5D and 3D packaging and integrated photonics—and standardised chiplet interfaces that enable interoperability and foster a dynamic chiplet ecosystem.
Projects should deliver a direct and immediate impact on European industry. Proposed solutions are expected to be demonstrated in laboratory and pilot environments and verified in semiconductor manufacturing use cases, with work centred on Technology Readiness Levels (TRLs) 5–7. Proposals must also facilitate knowledge transfer and stakeholder engagement through industry workshops, publications, and networking events.
