International collaboration EU and Japan on semiconductors supports EU–Japan consortia developing AI chiplets, advanced integration and chiplet interfaces to deliver direct benefits for European industry.
AI chip demonstrators for EU compute infrastructure supports EU fabless companies and system partners in demonstrating and validating AI chips for integration into European compute infrastructure.
AI compute evaluation and deployment platform for EU infrastructure supports buyers and suppliers in evaluating and piloting European AI chips and systems to strengthen EU technological sovereignty.
Recruitment Cycle Cohort 2027 supports master's students with tuition waivers and scholarships for Embedded Systems Design studies, reducing financial barriers and advancing diversity in digital expertise.
CHIPS program offers funding for building/upgrading US semiconductor materials and equipment facilities with investments under $300M.
Advanced manufacturing for key products (IA) (Made in Europe partnership) supports consortia developing manufacturing technologies and machinery to strengthen Europe’s industrial resilience and resource efficiency.